Invention Grant
US08269356B2 Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
有权
引线接合结构和方法，消除了特殊的可焊接结合，降低了基板上的接合间距
- Patent Title: Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
- Patent Title (中): 引线接合结构和方法，消除了特殊的可焊接结合，降低了基板上的接合间距
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Application No.: US12973410Application Date: 2010-12-20
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Publication No.: US08269356B2Publication Date: 2012-09-18
- Inventor: Rajendra D. Pendse , Byung Joon Han , Hun Teak Lee
- Applicant: Rajendra D. Pendse , Byung Joon Han , Hun Teak Lee
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley M. Chang
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44
Abstract:
A semiconductor package has a semiconductor die disposed on a substrate. A bond wire is connected between a first bonding site on the semiconductor die and a second bonding site on the substrate. The first bonding site is a die bond pad; the second bonding site is a stitch bond. The second bonding site has a bond finger formed on the substrate, a conductive layer in direct physical contact with the bond finger, and a bond stud coupled to the bond wire and in direct physical contact with the conductive layer to conduct an electrical signal from the semiconductor die to the bond finger. The bond finger is made of copper. The conductive layer is made of copper or gold. The bond stud is made of gold and overlies a side portion and top portion of the copper layer.
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