Invention Grant
US08269358B2 Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element 失效
双(氨基苯酚)衍生物,其制造方法,聚酰胺树脂,正性感光性树脂组合物,保护膜,层间绝缘膜,半导体装置,显示元件

  • Patent Title: Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element
  • Patent Title (中): 双(氨基苯酚)衍生物,其制造方法,聚酰胺树脂,正性感光性树脂组合物,保护膜,层间绝缘膜,半导体装置,显示元件
  • Application No.: US12446751
    Application Date: 2007-10-23
  • Publication No.: US08269358B2
    Publication Date: 2012-09-18
  • Inventor: Koji Terakawa
  • Applicant: Koji Terakawa
  • Applicant Address: JP Tokyo
  • Assignee: Sumitomo Bakelite Company Limited
  • Current Assignee: Sumitomo Bakelite Company Limited
  • Current Assignee Address: JP Tokyo
  • Agency: Ditthavong Mori & Steiner, P.C.
  • Priority: JP2006-288191 20061024; JP2006-290798 20061026; JP2007-219344 20070827; JP2007-219345 20070827
  • International Application: PCT/JP2007/070978 WO 20071023
  • International Announcement: WO2008/050886 WO 20080502
  • Main IPC: H01L23/29
  • IPC: H01L23/29 C07C211/55 C08G65/38 G03F7/004
Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element
Abstract:
A bis(aminophenol) derivative having substituents at positions adjacent to two amino groups is provided. The bis(aminophenol) derivative is used as a raw material of a polyamide resin for a positive-tone photosensitive resin composition. A polyamide resin comprising bis(aminophenol) and a structure derived from a carboxylic acid is also provided, the bis(aminophenol) having substituents at positions adjacent to the two amino groups. A positive-tone photosensitive resin composition comprising a polybenzooxazole precursor resin, exhibiting high sensitivity and a high cyclization rate even when cured at a low temperature is provided. Also provided is a positive-tone photosensitive resin composition comprising a polyamide resin having an imide structure, an imide precursor structure, or an amide acid ester structure. The composition exhibits high sensitivity and produces a cured product having low water absorption even when cured at a low temperature.
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