Invention Grant
US08269409B2 Method of fabricating a light-emitting device (LED) utilizing powder/pelletized homogeneously mixed molding compound
有权
使用粉末/颗粒化均匀混合的模塑料制造发光器件(LED)的方法
- Patent Title: Method of fabricating a light-emitting device (LED) utilizing powder/pelletized homogeneously mixed molding compound
- Patent Title (中): 使用粉末/颗粒化均匀混合的模塑料制造发光器件(LED)的方法
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Application No.: US11079323Application Date: 2005-03-14
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Publication No.: US08269409B2Publication Date: 2012-09-18
- Inventor: Stephen G. Kelly
- Applicant: Stephen G. Kelly
- Applicant Address: US CA Irvine
- Assignee: Microsemi Corporation
- Current Assignee: Microsemi Corporation
- Current Assignee Address: US CA Irvine
- Agency: Marger, Johnson & McCollom, P.C.
- Main IPC: H01J1/62
- IPC: H01J1/62 ; C09K11/56 ; C08K3/22 ; H01L21/44

Abstract:
The present invention comprises a process of mixing a luminous substance in powder form to a transferable grade molding compound in a pelletized or powder form, such as a clear epoxy, to derive a homogeneous mixture that can be pressed and sintered into solid pellets. The solid pellets are further processed so as to permit their deposition on and around a light emitting semiconductor driver so as to obtain a white light emitting semiconductor device. This white light emitting device can be used in a variety of lighting applications.
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