Disclosed are light emitting display and method of manufacturing the same. The light emitting display according to the present embodiments includes a first substrate including a plurality of light emitting devices and a pad portion, all of which are formed therein; a second substrate disposed to face the light emitting devices; and a bonding layer bonded to the light emitting devices and the second substrate, wherein a stepped portion is formed at a predetermined depth in an edge of the second substrate that is adjacent to the pad portion, and the bonding layer is extended to the stepped portion. Since the bonding layer is not bonded to the pad portion due to the depth of the stepped portion when the second substrate is bonded to the first substrate, poor electrical contact may be prevented, and it easy to remove the encapsulation substrate to expose the pad portion. Also, the manufacturing process is simple, the process uniformity is high and the process time is short since the bonding layer is formed in the front of the second substrate.