This invention describes a device for testing a surface mounted connector using a test probe assembly that utilizes a vacuum to force the test wires and the test probe's wire array into intimate contact with the connector to be tested. The wires are directed through a wire module assembly and have a wide spacing at one end, and a narrow spacing corresponding to the spacing required for the specific units to be tested at the opposite end. The wires are kept in contact with the unit under test by the use of spring loaded test connectors and vacuum.