Invention Grant
- Patent Title: Band-pass filter, high-frequency component, and communication apparatus
- Patent Title (中): 带通滤波器,高频分量和通信装置
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Application No.: US12277473Application Date: 2008-11-25
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Publication No.: US08269581B2Publication Date: 2012-09-18
- Inventor: Keisuke Fukamachi , Shigeru Kemmochi
- Applicant: Keisuke Fukamachi , Shigeru Kemmochi
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2007-308109 20071129; JP2008-274039 20081024
- Main IPC: H01P1/203
- IPC: H01P1/203 ; H01P7/08

Abstract:
A band-pass filter according to the present invention includes two or more resonant lines arranged side by side in a direction orthogonal to a laminating direction in a laminate substrate formed by laminating plural dielectric layers. Each of the resonant lines has a first coil pattern portion formed in the dielectric layers and a second coil pattern portion formed in the dielectric layers different from the dielectric layers in which the first coil pattern portion is formed. The first and second coil pattern portions are connected in series and formed in a spiral shape. At least one of the first and second coil pattern portions is formed as parallel lines in the plural dielectric layers. According to such a configuration, a band-pass filter that is reduced in size and reduced in loss is provided.
Public/Granted literature
- US20090160582A1 BAND-PASS FILTER, HIGH-FREQUENCY COMPONENT, AND COMMUNICATION APPARATUS Public/Granted day:2009-06-25
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