Invention Grant
- Patent Title: Wiring structures for panels
- Patent Title (中): 面板接线结构
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Application No.: US12062385Application Date: 2008-04-03
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Publication No.: US08269730B2Publication Date: 2012-09-18
- Inventor: Hua-Chi Hu , Naejye Hwang
- Applicant: Hua-Chi Hu , Naejye Hwang
- Applicant Address: TW Hsinchu
- Assignee: Integrated Digital Technologies, Inc.
- Current Assignee: Integrated Digital Technologies, Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Main IPC: G06F3/041
- IPC: G06F3/041

Abstract:
A panel capable of detecting an input signal applied on or over the panel comprises an array of sensor elements divided into first M1 groups arranged in rows and columns and second M1 groups arranged in rows and columns, each group in one of the first and second M1 groups including a number of M rows by N columns sensor elements, M1, M and N being integers, wherein each of the sensor elements includes a first port and a second port, M1 gate lines, wherein each of the M1 gate lines is coupled to one group of the first M1 groups and one group of the second M1 groups, and wherein the each of the M1 gate lines is coupled to the first port of each of the sensor elements in the one group of the first M1 groups and the one group of the second M1 groups, a first set of N fan-out lines, wherein each of the N fan-out lines is coupled to one column of the N columns of sensor elements in each of the groups at each of the columns of the first M1 groups, and a second set of N fan-out lines, wherein each of the N fan-out lines is coupled to one column of the N columns of sensor elements in each of the groups at each of the columns of the second M1 groups.
Public/Granted literature
- US20090251395A1 WIRING STRUCTURES FOR PANELS Public/Granted day:2009-10-08
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