Invention Grant
- Patent Title: Thermal dissipation for imager head assembly of remote inspection device
- Patent Title (中): 远程检测装置的成像头组件散热
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Application No.: US12038337Application Date: 2008-02-27
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Publication No.: US08269828B2Publication Date: 2012-09-18
- Inventor: Jeffrey J. Miller , Al Boehnlein , Tye Newman
- Applicant: Jeffrey J. Miller , Al Boehnlein , Tye Newman
- Applicant Address: US MI Plymouth
- Assignee: Perceptron, Inc.
- Current Assignee: Perceptron, Inc.
- Current Assignee Address: US MI Plymouth
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H04N3/36
- IPC: H04N3/36
Abstract:
An imager head assembly for a remote inspection device includes an imager housing. A circuit board is positioned within the imager housing. The circuit board has a light emitting diode connected thereto. A thermally conductive material in contact with the circuit board and the imager housing creates a conductive heat transfer path to dissipate heat generated by the light emitting diode through the imager housing. A light transmissive light pipe unit can be positioned proximate the circuit board to permit light emitted by the light emitting diode to pass through the light pipe unit.
Public/Granted literature
- US20080158349A1 Thermal Dissipation For Imager Head Assembly Of Remote Inspection Device Public/Granted day:2008-07-03
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