Invention Grant
- Patent Title: Sensing structure
- Patent Title (中): 感应结构
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Application No.: US12141429Application Date: 2008-06-18
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Publication No.: US08269940B2Publication Date: 2012-09-18
- Inventor: Han Ping Kuo , Cheng Yi Su
- Applicant: Han Ping Kuo , Cheng Yi Su
- Applicant Address: TW Hsinchu
- Assignee: AU Optronics Corp.
- Current Assignee: AU Optronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Thomas, Kayden, Horstemeyer & Risley, LLP
- Priority: TW97104180A 20080204
- Main IPC: G02F1/1345
- IPC: G02F1/1345 ; G02F1/1335

Abstract:
A sensing structure is provided. The sensing structure includes a first substrate, a second substrate, a sensing unit, and a flexible printed circuit (FPC). The sensing unit is disposed on the first substrate and adapted to generate a signal when the sensing unit is touched. The FPC has a first end and a second end. The first end includes a first connecting portion and a second connecting portion. The first connecting portion is disposed on the first substrate and electrically connected to the sensing unit, and the second connecting portion connects to the second substrate.
Public/Granted literature
- US20090194342A1 Sensing Structure Public/Granted day:2009-08-06
Information query
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