Invention Grant
- Patent Title: Method for measuring characteristic of object to be measured, structure causing diffraction phenomenon, and measuring device
- Patent Title (中): 用于测量待测物体的特性的方法，引起衍射现象的结构和测量装置
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Application No.: US13239830Application Date: 2011-09-22
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Publication No.: US08269967B2Publication Date: 2012-09-18
- Inventor: Seiji Kamba , Takashi Kondo , Koji Tanaka , Kazuhiro Takigawa , Yuichi Ogawa
- Applicant: Seiji Kamba , Takashi Kondo , Koji Tanaka , Kazuhiro Takigawa , Yuichi Ogawa
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-fu JP Sendai-shi, Miyagi
- Assignee: Murata Manufacturing Co., Ltd.,National University Corporation Tohoku University
- Current Assignee: Murata Manufacturing Co., Ltd.,National University Corporation Tohoku University
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-fu JP Sendai-shi, Miyagi
- Agency: Dickstein Shapiro LLP
- Priority: JP2009-080107 20090327
- Main IPC: G01J3/28
- IPC: G01J3/28
Abstract:
A method of attaching an object to be measured to a structure causing a diffraction phenomenon; irradiating the structure to which the object to be measured is attached and which causes the diffraction phenomenon with an electromagnetic wave; detecting the electromagnetic wave scattered by the structure causing the diffraction phenomenon; and measuring a characteristic of the object to be measured from the frequency characteristic of the detected electromagnetic wave. The object to be measured is attached directly to the surface of the structure causing the diffraction phenomenon. Thus, the method for measuring the characteristic of an object to be measured exhibits an improved measurement sensitivity and high reproducibility. A structure causing a diffraction phenomenon and used for the method, and a measuring device are provided.
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