Invention Grant
- Patent Title: Electronic device
- Patent Title (中): 电子设备
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Application No.: US12893966Application Date: 2010-09-29
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Publication No.: US08270157B2Publication Date: 2012-09-18
- Inventor: Takeshi Hongo
- Applicant: Takeshi Hongo
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2009-298500 20091228
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
According to one embodiment, the electronic device includes: a heating element that has: a first electronic part; and a plurality of connection terminals provided around the first electronic part; a first circuit board that has: a first surface; a second surface opposite to the first surface; an opening; and a plurality of pads provided around the opening at the first surface to be electrically connected with the connection terminals, respectively; a heat receiving member that has a heat receiving portion faced to the heating element and that is thermally connected to the heating element; a pressing member that presses the heat receiving member toward the first circuit board; and a support member that supports the first circuit board at a periphery of the opening from the second surface.
Public/Granted literature
- US20110157832A1 ELECTRONIC DEVICE Public/Granted day:2011-06-30
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