An electronic apparatus includes a circuit board, a first and a second electronic components installed on the circuit board, and a heat dissipation device. The heat dissipation device includes a centrifugal fan defining a first air outlet and a second air outlet, a first fin assembly disposed at the first outlet of the centrifugal fan, a second fin assembly disposed at the second outlet of the centrifugal fan and thermally contacting the second electronic component, and a heat pipe. The heat pipe includes an evaporating section, a first condensing section and a second condensing section located at two ends of the evaporating section. The evaporating section thermally contacts the first electronic component. The first condensing section is thermally attached to the second fin assembly, and the second condensing section is thermally attached to the first fin assembly.