Invention Grant
- Patent Title: Cooling arrangement for a rack mounted processing device
- Patent Title (中): 机架式处理装置的冷却装置
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Application No.: US12787171Application Date: 2010-05-25
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Publication No.: US08270171B2Publication Date: 2012-09-18
- Inventor: Susheela Nanjunda Rao Narasimhan , Hong Tran Huynh , Toan Nguyen , Duong Cu Lu , Phillip S. Ting
- Applicant: Susheela Nanjunda Rao Narasimhan , Hong Tran Huynh , Toan Nguyen , Duong Cu Lu , Phillip S. Ting
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Brinks Hofer Gilson & Lione
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.
Public/Granted literature
- US20110292602A1 COOLING ARRANGEMENT FOR A RACK MOUNTED PROCESSING DEVICE Public/Granted day:2011-12-01
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