Invention Grant
- Patent Title: Exposed interconnect for a package on package system
- Patent Title (中): 封装系统上封装的裸露互连
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Application No.: US12188995Application Date: 2008-08-08
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Publication No.: US08270176B2Publication Date: 2012-09-18
- Inventor: Reza Argenty Pagaila , Byung Tai Do , Linda Pei Ee Chua
- Applicant: Reza Argenty Pagaila , Byung Tai Do , Linda Pei Ee Chua
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley M. Chang
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
An integrated circuit package system includes: providing a substrate; mounting an integrated circuit above the substrate; connecting an interposer to the integrated circuit with a wire-in-film adhesive; connecting an exposed interconnect having an upper surface to the substrate; and encapsulating the integrated circuit with an encapsulation.
Public/Granted literature
- US20100033941A1 EXPOSED INTERCONNECT FOR A PACKAGE ON PACKAGE SYSTEM Public/Granted day:2010-02-11
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