Invention Grant
- Patent Title: Active device array substrate
- Patent Title (中): 有源器件阵列衬底
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Application No.: US12822201Application Date: 2010-06-24
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Publication No.: US08270178B2Publication Date: 2012-09-18
- Inventor: Po-Lin Chen , Chih-Yuan Lin , Yu-Min Lin , Chun-Nan Lin
- Applicant: Po-Lin Chen , Chih-Yuan Lin , Yu-Min Lin , Chun-Nan Lin
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99108356A 20100322
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01L27/14 ; H01L23/48

Abstract:
An active device array substrate has at least one patterned conductive layer. The patterned conductive layer includes a copper layer. A cross-section of the copper layer which is parallel to a normal line direction of the copper layer includes a first trapezoid and a second trapezoid stacked on the first trapezoid. A base angle of the first trapezoid and a base angle of the second trapezoid are acute angles, and a difference between the base angle of the first trapezoid and the base angle of the second trapezoid is from about 5° to about 30°.
Public/Granted literature
- US20110228502A1 ACTIVE DEVICE ARRAY SUBSTRATE AND FABRICATING METHOD THEREOF Public/Granted day:2011-09-22
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