Invention Grant
- Patent Title: Mobile phone with metal hinged shield
- Patent Title (中): 手机带金属铰链屏蔽
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Application No.: US12949823Application Date: 2010-11-19
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Publication No.: US08270182B2Publication Date: 2012-09-18
- Inventor: Hsin-Hung Liu , Tsung-Lin Hsieh
- Applicant: Hsin-Hung Liu , Tsung-Lin Hsieh
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
The mobile phone includes a printed circuit board (PCB), a metal hinged shield, and a connecting member. The metal hinged shield is pivoted on the PCB by the connecting member. The metal hinged shield further comprises a high metal body and a low metal body. The high metal body partially overlaps the low metal body.
Public/Granted literature
- US20120106119A1 MOBILE PHONE WITH METAL HINGED SHIELD Public/Granted day:2012-05-03
Information query
