Invention Grant
US08270239B2 Semiconductor memory device and methods of performing a stress test on the semiconductor memory device
失效
半导体存储器件以及对半导体存储器件进行应力测试的方法
- Patent Title: Semiconductor memory device and methods of performing a stress test on the semiconductor memory device
- Patent Title (中): 半导体存储器件以及对半导体存储器件进行应力测试的方法
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Application No.: US12330747Application Date: 2008-12-09
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Publication No.: US08270239B2Publication Date: 2012-09-18
- Inventor: Nan Chen , Changho Jung , Zhiqin Chen
- Applicant: Nan Chen , Changho Jung , Zhiqin Chen
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Sam Talpalatsky; Nicholas J. Pauley; Jonathan T. Velasco
- Main IPC: G11C29/50
- IPC: G11C29/50 ; G11C29/06 ; G11C29/00 ; G11C11/41 ; G11C11/413 ; G11C8/08 ; G11C7/12

Abstract:
A semiconductor memory device and method of performing a stress test on a semiconductor memory device are provided. In an example, the semiconductor memory device includes a multiplexer arrangement configured to switch a timing signal that controls an internal timing of the semiconductor memory device from an internal signal to an external signal during a stress mode, and further includes one or more word lines of the semiconductor memory device receiving a stress voltage during the stress mode, a duration of the stress mode based upon the external signal. In another example, the semiconductor memory device includes one or more word lines configured to receive a stress voltage during a stress mode, and a precharge circuit configured to provide a precharge voltage to a bit line of the semiconductor memory device during the stress mode.
Public/Granted literature
- US20100142300A1 Semiconductor Memory Device And Methods Of Performing A Stress Test On The Semiconductor Memory Device Public/Granted day:2010-06-10
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