Invention Grant
- Patent Title: Thermally assisted magnetic recording head and head assembly
- Patent Title (中): 热辅助磁记录头和头组件
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Application No.: US12995253Application Date: 2009-06-01
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Publication No.: US08270262B2Publication Date: 2012-09-18
- Inventor: Irizo Naniwa , Takuya Matsumoto , Satoshi Arai , Junichiro Shimizu
- Applicant: Irizo Naniwa , Takuya Matsumoto , Satoshi Arai , Junichiro Shimizu
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: JP2008-144902 20080602
- International Application: PCT/JP2009/059968 WO 20090601
- International Announcement: WO2009/148012 WO 20091210
- Main IPC: G11B7/085
- IPC: G11B7/085
Abstract:
In a thermally assisted magnetic recording head (10A), a sub-mount (8A) on which a laser diode is mounted is arranged between an HGA (41) and a magnetic head slider (9). The sub-mount has a wiring line (81) which electrically connects a terminal (91) arranged on the magnetic head slider (9) and a terminal (411) arranged on the HGA (41).
Public/Granted literature
- US20110149698A1 THERMALLY ASSISTED MAGNETIC RECORDING HEAD AND HEAD ASSEMBLY Public/Granted day:2011-06-23
Information query
IPC分类:
