A microphone assembly includes a microphone array carrier having a top surface and a plurality of side faces adjacent to the top surface. The top surface and the plurality of side faces each have a substantially planar portion. The substantially planar portion of each of the side faces extends substantially perpendicular to the substantially planar portion of the top surface. Each side face has a side opening extending through the side face and the top surface has a top opening extending through the top surface. The microphone assembly also includes a plurality of microphones corresponding to the side faces. Each microphone is mounted with a microphone boot in a side opening and is isolated from the microphone array carrier by the microphone boot. The microphone assembly also includes a housing extending around the microphone array carrier and sound isolating material disposed between the microphone array carrier and the housing.