A connection arrangement for connecting together two superconductor cables, each having a central conductor comprising at least one superconductive part, a dielectric layer surrounding said central conductor, a shield surrounding said dielectric layer and a cryogenic enclosure surrounding said shield, the connection arrangement has an electrical splicing device for splicing together the central conductors and stripped dielectric layers of the corresponding shields. This connection arrangement has a covering made of semi-conductive material that is placed between the two shield ends and an electrical connection device for connecting together the two shield ends, the connection device surrounding the covering, being contained in the cryogenic enclosure, and comprising two junction elements each electrically and mechanically joined to a respective one of the shield ends, and an electrical splicing arrangement for splicing together the two junction elements.