Invention Grant
- Patent Title: Medical device conductor junctions
- Patent Title (中): 医疗器械导体接头
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Application No.: US12726875Application Date: 2010-03-18
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Publication No.: US08271100B2Publication Date: 2012-09-18
- Inventor: Gregory A. Boser , Ryan J. Collins , Mark T. Marshall , Grant H. Wurdell
- Applicant: Gregory A. Boser , Ryan J. Collins , Mark T. Marshall , Grant H. Wurdell
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Carl F. Barry
- Main IPC: A61N1/05
- IPC: A61N1/05 ; H01R4/24 ; H01R9/053

Abstract:
A medical electrical lead includes a lead body, an inner assembly extending throught the lead body, an outer insulative layer covering the inner assembly, and an electrode mounted outside the exterior surface of the outer insulative layer. The inner assembly includes an elongate inner structure forming a lumen, an elongate conductor extending along an outer surface of the inner structure, and a conductive fitting coupled to the elongate conductor.
Public/Granted literature
- US20100174350A1 NOVEL MEDICAL DEVICE CONDUCTOR JUNCTIONS Public/Granted day:2010-07-08
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