Invention Grant
US08273458B2 Adhesive for bonding circuit members, circuit board and process for its production
有权
用于粘合电路元件，电路板及其生产工艺的粘合剂
- Patent Title: Adhesive for bonding circuit members, circuit board and process for its production
- Patent Title (中): 用于粘合电路元件，电路板及其生产工艺的粘合剂
-
Application No.: US13166591Application Date: 2011-06-22
-
Publication No.: US08273458B2Publication Date: 2012-09-25
- Inventor: Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
- Applicant: Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP9-30983 19970214; JP9-32003 19970217; JP9-32004 19970217
- Main IPC: B32B27/38
- IPC: B32B27/38
Abstract:
An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
Public/Granted literature
- US20110247867A1 ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION Public/Granted day:2011-10-13
Information query
