Invention Grant
- Patent Title: Adhesive composition and adhesion method
- Patent Title (中): 粘合剂组合物和粘合方法
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Application No.: US13122020Application Date: 2009-10-08
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Publication No.: US08273827B2Publication Date: 2012-09-25
- Inventor: Yuki Hisha , Kimihiko Yoda , Kazuhiro Oshima
- Applicant: Yuki Hisha , Kimihiko Yoda , Kazuhiro Oshima
- Applicant Address: JP Tokyo
- Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Hoffmann & Baron, LLP
- Priority: JP2008-262015 20081008
- International Application: PCT/JP2009/067543 WO 20091008
- International Announcement: WO2010/041710 WO 20100415
- Main IPC: C08F8/00
- IPC: C08F8/00 ; C08L33/02 ; C08L33/04 ; C08L35/02

Abstract:
Disclosed is an adhesive composition having adhesion properties, high-speed curing properties and moisture resistance. Also disclosed is an adhesion method. Specifically disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (C) a compound having an enal structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) the nitrile-butadiene rubber, (B) the (meth)acrylic composition, (D) a compound having an amine structure, and (E) a compound containing copper. Also disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (D) a compound having an amine structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) the nitrile-butadiene rubber, (B) the (meth)acrylic composition, (C) a compound having an enal structure, and (E) a compound containing copper.
Public/Granted literature
- US20110190414A1 ADHESIVE COMPOSITION AND ADHESION METHOD Public/Granted day:2011-08-04
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