Invention Grant
- Patent Title: Wiring board
- Patent Title (中): 接线板
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Application No.: US12900173Application Date: 2010-10-07
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Publication No.: US08273992B2Publication Date: 2012-09-25
- Inventor: Yoshiaki Sato
- Applicant: Yoshiaki Sato
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2009-233880 20091007
- Main IPC: H05K1/09
- IPC: H05K1/09

Abstract:
The wiring board includes: a base material; a copper pattern which is formed in one surface of the base material, and made of a first metal; and a first nickel land and a second nickel land which are formed over the copper pattern in contact with the copper pattern, and made of a second metal having a higher ionization tendency than that of the first metal, wherein a groove reaching the base material is formed in the copper pattern around a region overlapping the first nickel land at least when seen in a plan view.
Public/Granted literature
- US20110079419A1 WIRING BOARD Public/Granted day:2011-04-07
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