Invention Grant
- Patent Title: Semiconductor package system with patterned mask over thermal relief
- Patent Title (中): 具有图形掩模的半导体封装系统
-
Application No.: US11773951Application Date: 2007-07-05
-
Publication No.: US08274145B2Publication Date: 2012-09-25
- Inventor: Leocadio M. Alabin , Librado Gatbonton , Chiu Hsieh Ong , Beng Yee Teh , Antonio B. Dimaano, Jr.
- Applicant: Leocadio M. Alabin , Librado Gatbonton , Chiu Hsieh Ong , Beng Yee Teh , Antonio B. Dimaano, Jr.
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley M. Chang
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor package system including: providing a substrate having a thermal relief thereon; depositing a mask on the substrate and the thermal relief, the mask deposited on the thermal relief and having a regular pattern to partially cover the thermal relief; and die attaching a semiconductor die over the thermal relief.
Public/Granted literature
- US20090008768A1 SEMICONDUCTOR PACKAGE SYSTEM WITH PATTERNED MASK OVER THERMAL RELIEF Public/Granted day:2009-01-08
Information query
IPC分类:
