Invention Grant
- Patent Title: Structure for transmission in power supply
- Patent Title (中): 电源传输结构
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Application No.: US12418764Application Date: 2009-04-06
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Publication No.: US08274181B2Publication Date: 2012-09-25
- Inventor: Shao-Feng Lu
- Applicant: Shao-Feng Lu
- Applicant Address: TW Taoyuan, Taoyuan Hsien TW Gueishan Shiang, Taoyuan Hsien
- Assignee: FSP Technology Inc.,3Y Power Technology (Taiwan), Inc.
- Current Assignee: FSP Technology Inc.,3Y Power Technology (Taiwan), Inc.
- Current Assignee Address: TW Taoyuan, Taoyuan Hsien TW Gueishan Shiang, Taoyuan Hsien
- Agent Winston Hsu; Scott Margo
- Main IPC: H01B7/30
- IPC: H01B7/30 ; H01B11/02 ; H02B1/20 ; H02G5/06

Abstract:
A structure for transmission in a power supply, particularly to a power structure for transmission for bearing large DC current, wherein the power supply includes a power input port for connecting to DC input power and a DC/DC conversion circuit for converting the DC input power into DC output power. The architecture including at least one power transmission board for disposing the power input port, wherein the power transmission board is electrically connected to the power process board with the DC/DC conversion circuit mounted thereon by at least one power conduction element. Therefore, through the power conduction elements replacing the conventional connecting wires with large diameter to connect the power input port and the power process board without disobeying the safety regulation, not only the space occupied by the bent connection wires can be reduced, but the collisions and damage to other components caused therefrom also can be avoided.
Public/Granted literature
- US20100253155A1 STRUCTURE FOR TRANSMISSION IN POWER SUPPLY Public/Granted day:2010-10-07
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