Invention Grant
- Patent Title: Light emitting device having semiconductor laser and fluorescent material and method for manufacturing the same
- Patent Title (中): 具有半导体激光器和荧光材料的发光器件及其制造方法
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Application No.: US12725538Application Date: 2010-03-17
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Publication No.: US08274209B2Publication Date: 2012-09-25
- Inventor: Naoki Wada
- Applicant: Naoki Wada
- Applicant Address: JP Ehime JP Tokyo
- Assignee: Harison Toshiba Lighting Corp.,Kabushiki Kaisha Toshiba
- Current Assignee: Harison Toshiba Lighting Corp.,Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Ehime JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2009-77312 20090326; JP2009-179015 20090731
- Main IPC: H01L21/78
- IPC: H01L21/78 ; F21V9/16
Abstract:
A light emitting device, includes: a casing; a window; a semiconductor laser provided in an enclosed space formed by the casing and the window; and a fluorescent material in a form of any one of a crystal and glass, the fluorescent material being provided in the enclosed space, the fluorescent material absorbing laser light emitted from the semiconductor laser and emitting secondary light having a wavelength different from a wavelength of the laser light, and the secondary light being taken out through the window.
Public/Granted literature
- US20100246159A1 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-09-30
Information query
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