Invention Grant
- Patent Title: High power, low profile, broadband antenna
- Patent Title (中): 大功率,低调,宽带天线
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Application No.: US12569470Application Date: 2009-09-29
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Publication No.: US08274439B2Publication Date: 2012-09-25
- Inventor: Gary E. Miller , William O. Price
- Applicant: Gary E. Miller , William O. Price
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Moore & Van Allen PLLC
- Agent Charles L. Moore
- Main IPC: H01Q1/02
- IPC: H01Q1/02

Abstract:
An antenna may include an enclosure formed by a front wall and a back wall opposite to the front wall, and a front face and a back face opposite to the front face. Both the front face and the back face extend between the front wall and the back wall to form a cavity within the enclosure. The enclosure further includes a slot formed in the front face to form a cavity backed slot. A radio frequency (RF) connector is mounted in the front wall. A shaped feed line is mounted within the cavity and is electrically connected to the RF connector to transmit and receive RF energy. The shaped feed line extends across the slot to couple the RF energy between the slot and the shaped feed line. The shaped feed line has a predetermined structure to substantially reduce an electric field strength to improve power handing of the antenna.
Public/Granted literature
- US20110074642A1 HIGH POWER, LOW PROFILE, BROADBAND ANTENNA Public/Granted day:2011-03-31
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