A flexible printed circuit includes: a first wiring layer and a second wiring layer being in contact with one surface of a flexible substrate, a third wiring layer and a fourth wiring layer on the other surface of the flexible substrate, a first conductive member being formed on surfaces in proximity to a through hole of the second wiring layer and the fourth wiring layer; a second conductive member being formed on surfaces in proximity to the first end section of the first wiring layer and the third wiring layer; and an insulating layer being formed in a space between the first wiring layer and the second conductive member, and the second wiring layer and the first conductive member and a space between the third wiring layer and the second conductive member, and the fourth wiring layer and the first conductive member.