Invention Grant
- Patent Title: Carrier substrate and method for making the same
- Patent Title (中): 载体基板及其制造方法
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Application No.: US12845717Application Date: 2010-07-28
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Publication No.: US08274798B2Publication Date: 2012-09-25
- Inventor: Shih-Jung Huang , Wen-Fang Liu , Ling-Kai Su
- Applicant: Shih-Jung Huang , Wen-Fang Liu , Ling-Kai Su
- Applicant Address: TW Kwei-San Industrial Zone, Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Kwei-San Industrial Zone, Taoyuan
- Agent Winston Hsu; Scott Margo
- Main IPC: H01R9/00
- IPC: H01R9/00
Abstract:
A carrier substrate includes a substrate having a chip side and a PCB side, a plurality of bond pads disposed on the chip side for bonding a chip, a plurality of land grid array (LGA) pads disposed on the PCB side, and a plurality of resilient flanges installed on the PCB side in an array manner. The plurality of resilient flanges electrically connects with the LGA pads correspondingly.
Public/Granted literature
- US20120026708A1 CARRIER SUBSTRATE AND METHOD FOR MAKING THE SAME Public/Granted day:2012-02-02
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