Invention Grant
- Patent Title: Surface mounting apparatus
- Patent Title (中): 表面贴装装置
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Application No.: US12306701Application Date: 2007-06-29
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Publication No.: US08276263B2Publication Date: 2012-10-02
- Inventor: Masashi Wada , Hirotoshi Yamagata , Hiroyuki Takagi , Akira Kishida , Hiroaki Fujita
- Applicant: Masashi Wada , Hirotoshi Yamagata , Hiroyuki Takagi , Akira Kishida , Hiroaki Fujita
- Applicant Address: JP
- Assignee: Yamaha Hatsudoki Kabushiki Kaisha
- Current Assignee: Yamaha Hatsudoki Kabushiki Kaisha
- Current Assignee Address: JP
- Agency: Studebaker & Brackett PC
- Agent Donald R. Studebaker
- Priority: JP2006-180210 20060629; JP2006-180215 20060629; JP2006-182407 20060630; JP2006-182421 20060630; JP2006-182426 20060630; JP2006-182434 20060630
- International Application: PCT/JP2007/063164 WO 20070629
- International Announcement: WO2008/001910 WO 20080103
- Main IPC: H05K13/04
- IPC: H05K13/04

Abstract:
A surface mounting apparatus includes a conveyer supporting a printed wiring board being moved in a transportation direction, and a board transfer device that lowers a pair of tab members to positions spaced apart upstream and downstream of the printed wiring board and moves the tab members in the transportation direction. The board transfer device includes an interval changing device to change an interval between a pair of the tab members and a sensor to detect the position of the printed wiring board, an interference determination means to determine the absence or presence of the printed wiring board at the positions to which both the tab members are to be lowered according to the position of the printed wiring board detected by the sensor and interval setting means to move the tab members by driving the interval changing device according to a detection result of the interference determination means.
Public/Granted literature
- US20090277002A1 SURFACE MOUNTING APPARATUS Public/Granted day:2009-11-12
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