Invention Grant
- Patent Title: System for mounting components on boards
- Patent Title (中): 将组件安装在电路板上的系统
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Application No.: US12613129Application Date: 2009-11-05
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Publication No.: US08276264B2Publication Date: 2012-10-02
- Inventor: Kouji Shimizu , Seiichi Terui
- Applicant: Kouji Shimizu , Seiichi Terui
- Applicant Address: JP Chiryu-shi
- Assignee: Fuji Machine Mfg. Co., Ltd.
- Current Assignee: Fuji Machine Mfg. Co., Ltd.
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2002-293839 20021007
- Main IPC: H05K13/04
- IPC: H05K13/04

Abstract:
A component mounting apparatus includes two board transfer devices, a component supply unit, a component placing device, a setting unit, and a controller. Until production of the urgent boards is instructed, the two board transfer devices and the component placing device mount components on the regular boards in accordance with a first mounting program stored by the controller. When production of the urgent boards is instructed, a regular board is unloaded from the other board transfer device, which has been set by the setting unit to transfer urgent boards, the transfer way width of the other board transfer device is adjusted to the width of the urgent boards, and the other board transfer device and the component placing device are controlled so that component mountings on the urgent boards are performed on the other board transfer device in accordance with a second mounting program stored by the controller.
Public/Granted literature
- US20100050426A1 SYSTEM FOR MOUNTING COMPONENTS ON BOARDS Public/Granted day:2010-03-04
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