Invention Grant
- Patent Title: Electronic component mounting machine and electronic component loading head
- Patent Title (中): 电子元件安装机和电子元件装载头
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Application No.: US13123078Application Date: 2009-10-08
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Publication No.: US08276265B2Publication Date: 2012-10-02
- Inventor: Yuji Tanaka , Tomohiro Kimura
- Applicant: Yuji Tanaka , Tomohiro Kimura
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JPP2008-263774 20081010
- International Application: PCT/JP2009/005256 WO 20091008
- International Announcement: WO2010/041458 WO 20100415
- Main IPC: H05K3/30
- IPC: H05K3/30 ; B23P19/00

Abstract:
A challenge to be met by the present invention is to provide an electronic component mounting machine and an electronic component loading head in which the loading head has two rows of nozzle shafts and that can promote miniaturization of the machine by minimizing the loading head. In a loading head having two rows of nozzles (L1 and L2) including a plurality of nozzle shafts arranged in rows and at a predetermined nozzle arrangement pitch, a θ rotary drive mechanism that rotates the nozzle shafts around their axes is configured so as to include driven pulleys (28) coupled to the respective nozzle shafts; a plurality of idlers (30) interposed between the two rows of nozzles (L1 and L2); and endless drive belts (29A and 29B) that transmit rotation of the θ-axis motors (27A and 27B) to the driven pulleys (28). Drive surfaces (29a) of the respective driving belts (29A and 29B) are looped around the respective drive pulleys and the respective driven pulleys, and the other sides of the respective drive surfaces (29a) are looped while guided by the idlers (30).
Public/Granted literature
- US20110192021A1 ELECTRONIC COMPONENT MOUNTING MACHINE AND ELECTRONIC COMPONENT LOADING HEAD Public/Granted day:2011-08-11
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