Invention Grant
- Patent Title: Method for mounting a component on a circuit board
- Patent Title (中): 将组件安装在电路板上的方法
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Application No.: US12247277Application Date: 2008-10-08
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Publication No.: US08276267B2Publication Date: 2012-10-02
- Inventor: Hyung-soo Choi , Tae-young Lee
- Applicant: Hyung-soo Choi , Tae-young Lee
- Applicant Address: KR Changwon
- Assignee: Samsung Techwin Co., Ltd.
- Current Assignee: Samsung Techwin Co., Ltd.
- Current Assignee Address: KR Changwon
- Agency: Drinker Biddle & Reath LLP
- Priority: KR10-2005-0094521 20051007
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
Provided are a tape feeder for use in chip mounters that can reduce a chip feeding duration and prevent chips from being turned over or assuming wrong postures to feed the chips stably, and a chip mounting method. The tape feeder includes a second link having one end linked to a link shaft through which a first link and a pivot lever are combined and the other end in which a slot curved at a predetermined inclination is formed. The velocity at which a carrier tape is fed changes according to the inclination of the curve of the slot with respect to the moving direction of the first link, the curve contacting the contact unit upon the movement of the first link in a direction helping to rotate a ratchet gear.
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