Invention Grant
US08276269B2 Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same
有权
双环氧介质和光敏焊料掩模涂料，以及其制备方法
- Patent Title: Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same
- Patent Title (中): 双环氧介质和光敏焊料掩模涂料，以及其制备方法
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Application No.: US12214700Application Date: 2008-06-20
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Publication No.: US08276269B2Publication Date: 2012-10-02
- Inventor: Houssam Jomaa , Omar J. Bchir
- Applicant: Houssam Jomaa , Omar J. Bchir
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01R9/00
- IPC: H01R9/00
Abstract:
A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface.
Public/Granted literature
- US20090314538A1 Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same Public/Granted day:2009-12-24
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