Invention Grant
- Patent Title: Magnetic pad for end-effectors
- Patent Title (中): 用于末端执行器的磁性垫
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Application No.: US12351409Application Date: 2009-01-09
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Publication No.: US08276959B2Publication Date: 2012-10-02
- Inventor: Kyung-Tae Kim
- Applicant: Kyung-Tae Kim
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: A47J45/00
- IPC: A47J45/00

Abstract:
Embodiments of the invention relate to apparatus and method for supporting and transferring large area substrate in a vacuum condition. One embodiment of the invention provides an apparatus comprising one or more end effectors having a plurality of end effector pads disposed thereon without mechanically joining to the one or more end effectors. In one embodiment, a plurality of end effector pad assemblies are coupled to one or more end effectors by magnetic force.
Public/Granted literature
- US20100034625A1 MAGNETIC PAD FOR END-EFFECTORS Public/Granted day:2010-02-11
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