Invention Grant
- Patent Title: Fluid ejection apparatus
- Patent Title (中): 流体喷射装置
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Application No.: US13026998Application Date: 2011-02-14
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Publication No.: US08277022B2Publication Date: 2012-10-02
- Inventor: Jun Shimazaki
- Applicant: Jun Shimazaki
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2007-268756 20071016
- Main IPC: B41J2/165
- IPC: B41J2/165
Abstract:
There is provided a fluid ejection apparatus for ejecting a fluid including a head for ejecting the fluid and a moisture retention head cap device for retaining moisture of the head. The moisture retention head cap device is disposed so as to surround a periphery of the head to cover the whole of the head when retaining moisture of the head.
Public/Granted literature
- US20110134186A1 FLUID EJECTION APPARATUS Public/Granted day:2011-06-09
Information query
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