A semiconductor integrated circuit includes a delay characteristic compensating circuit that is provided in a logic area including an inside and a surface of a chip. The delay characteristic compensating circuit includes a heat generating circuit that heats the semiconductor integrated circuit, a temperature sensor that measures a junction temperature, a voltage monitor that measures a power supply voltage, and a control circuit that actuates the heat generating circuit when the junction temperature does not reach a reference temperature and when the power supply voltage is lower than a reference voltage and stops actuating the heat generating circuit when the junction temperature reaches the reference temperature.