Invention Grant
US08277162B2 Unit for opening insert for test tray and method of mounting semiconductor device using the same
有权
用于测试盘的开口插入单元和使用其安装半导体器件的方法
- Patent Title: Unit for opening insert for test tray and method of mounting semiconductor device using the same
- Patent Title (中): 用于测试盘的开口插入单元和使用其安装半导体器件的方法
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Application No.: US12407454Application Date: 2009-03-19
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Publication No.: US08277162B2Publication Date: 2012-10-02
- Inventor: Yun Sung Na , Tae Hung Ku , Jung Woo Hwang
- Applicant: Yun Sung Na , Tae Hung Ku , Jung Woo Hwang
- Applicant Address: KR Hwaseong-Si, Gyeonggi-Do
- Assignee: Techwing Co., Ltd.
- Current Assignee: Techwing Co., Ltd.
- Current Assignee Address: KR Hwaseong-Si, Gyeonggi-Do
- Agency: BainwoodHuang
- Priority: KR10-2008-0027448 20080325
- Main IPC: B65G1/00
- IPC: B65G1/00
Abstract:
A unit for opening an insert of a test tray which comprises an accommodating space for accommodating a semiconductor device and a support for supporting the semiconductor device accommodated in the accommodating space, the unit includes a body, a pair of opening devices provided in the body to open the insert, and a positioning guide unit protruding to be inserted into an accommodating space for a semiconductor device when opening the insert and supporting the semiconductor device that is transferred into the accommodating space to be spaced upward apart from a support provided in the accommodating space.
Public/Granted literature
- US20090245982A1 UNIT FOR OPENING INSERT FOR TEST TRAY AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2009-10-01
Information query
IPC分类:
