Invention Grant
- Patent Title: Transfer mechanism with multiple wafer handling capability
- Patent Title (中): 具有多种晶片处理能力的转印机构
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Application No.: US11859755Application Date: 2007-09-22
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Publication No.: US08277165B2Publication Date: 2012-10-02
- Inventor: Farzad Tabrizi , David Barker
- Applicant: Farzad Tabrizi , David Barker
- Applicant Address: DE Radofzell
- Assignee: Dynamic Micro System Semiconductor Equipment GmbH
- Current Assignee: Dynamic Micro System Semiconductor Equipment GmbH
- Current Assignee Address: DE Radofzell
- Agent Tue Nguyen
- Main IPC: B25J15/00
- IPC: B25J15/00

Abstract:
An integrated robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly can comprise a multiple end effector for moving a plurality of workpieces, a single end effector for moving a single workpiece, a rotation chuck incorporated on the robot body to provide alignment capability, and an optional identification subsystem for identify the object during transport. The present invention robot assembly can be used in a sorter or stocker equipment, in processing equipment, and a transfer system.
Public/Granted literature
- US20090081007A1 Transfer mechanism with multiple wafer handling capability Public/Granted day:2009-03-26
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