An interconnect member is provided for electrically connecting an electronic module to a printed circuit. The interconnect member includes a substrate having a module side and an opposite circuit side. Module contacts are held by the substrate. The module contacts are arranged within an array along the module side of the substrate. The module contacts include module mating interfaces that are configured to be electrically connected to the electronic module. Circuit contacts are held by the substrate. The circuit contacts are arranged within an array along the circuit side of the substrate. The circuit contacts include circuit mating interfaces that are configured to be electrically connected to the printed circuit. Electrical components extend between and electrically connect corresponding module contacts to corresponding circuit contacts to provide electrical paths for electrical signals transmitted between the module and circuit contacts. At least one of the electrical components modifies the corresponding electrical signal transmitted along the electrical path between the corresponding module and circuit contacts.