Invention Grant
- Patent Title: Polishing pad and polishing device
- Patent Title (中): 抛光垫和抛光装置
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Application No.: US12550544Application Date: 2009-08-31
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Publication No.: US08277290B2Publication Date: 2012-10-02
- Inventor: Allen Chiu , Yu-Lung Jeng
- Applicant: Allen Chiu , Yu-Lung Jeng
- Applicant Address: TW Tao-Yuan Hsien
- Assignee: Bestac Advanced Material Co., Ltd.
- Current Assignee: Bestac Advanced Material Co., Ltd.
- Current Assignee Address: TW Tao-Yuan Hsien
- Agency: Sinorica, LLC
- Agent Ming Chow
- Priority: TW98206871U 20090424
- Main IPC: B24B5/00
- IPC: B24B5/00
Abstract:
A polishing pad used in semiconductor polishing process is provided in the present invention and a pressure sensitive adhesive is used to couple the polishing pad. The polishing pad includes a substrate, and the substrate includes a polishing surface and a reverse surface corresponding to the polishing surface. The polishing pad is characterized by: a pressure sensitive adhesive formed on the reverse surface of the substrate and used to couple with a bottom layer, and the horizontal adhesion of the pressure sensitive adhesive is higher than the vertical adhesion of the pressure sensitive adhesive.
Public/Granted literature
- US20100273404A1 Polishing Pad and Polishing Device Public/Granted day:2010-10-28
Information query
