Invention Grant
- Patent Title: Hybrid intervertebral disc system
- Patent Title (中): 混合椎间盘系统
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Application No.: US11487841Application Date: 2006-07-17
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Publication No.: US08277508B2Publication Date: 2012-10-02
- Inventor: Hai H. Trieu
- Applicant: Hai H. Trieu
- Applicant Address: US IN Warsaw
- Assignee: Warsaw Orthopedic
- Current Assignee: Warsaw Orthopedic
- Current Assignee Address: US IN Warsaw
- Main IPC: A61F2/44
- IPC: A61F2/44

Abstract:
An intervertebral disc prosthesis is adapted for implantation between first and second vertebral endplates. The prosthesis comprises a first endplate assembly for engaging the first vertebral endplate. The first endplate assembly has a concave first inner surface. The prosthesis further comprises a second endplate assembly for engaging the second vertebral endplate. The second endplate assembly has a concave second inner surface. The prosthesis further comprises a core component extending between the first and second inner surfaces and adapted to move relative to the concave first and second inner surfaces. The core component includes a flexible body extending between first and second end surfaces such that the end surfaces are not contiguous. The first and second end surfaces have a hardness greater than the flexible body.
Public/Granted literature
- US20060259144A1 Hybrid intervertebral disc system Public/Granted day:2006-11-16
Information query
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