Invention Grant
US08277508B2 Hybrid intervertebral disc system 有权
混合椎间盘系统

  • Patent Title: Hybrid intervertebral disc system
  • Patent Title (中): 混合椎间盘系统
  • Application No.: US11487841
    Application Date: 2006-07-17
  • Publication No.: US08277508B2
    Publication Date: 2012-10-02
  • Inventor: Hai H. Trieu
  • Applicant: Hai H. Trieu
  • Applicant Address: US IN Warsaw
  • Assignee: Warsaw Orthopedic
  • Current Assignee: Warsaw Orthopedic
  • Current Assignee Address: US IN Warsaw
  • Main IPC: A61F2/44
  • IPC: A61F2/44
Hybrid intervertebral disc system
Abstract:
An intervertebral disc prosthesis is adapted for implantation between first and second vertebral endplates. The prosthesis comprises a first endplate assembly for engaging the first vertebral endplate. The first endplate assembly has a concave first inner surface. The prosthesis further comprises a second endplate assembly for engaging the second vertebral endplate. The second endplate assembly has a concave second inner surface. The prosthesis further comprises a core component extending between the first and second inner surfaces and adapted to move relative to the concave first and second inner surfaces. The core component includes a flexible body extending between first and second end surfaces such that the end surfaces are not contiguous. The first and second end surfaces have a hardness greater than the flexible body.
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