Invention Grant
- Patent Title: Reactive hot melt adhesive
- Patent Title (中): 活性热熔胶
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Application No.: US12333795Application Date: 2008-12-12
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Publication No.: US08277601B2Publication Date: 2012-10-02
- Inventor: Andrew Slark , Malcolm Graham
- Applicant: Andrew Slark , Malcolm Graham
- Applicant Address: US CT Rocky Hill
- Assignee: Henkel Corporation
- Current Assignee: Henkel Corporation
- Current Assignee Address: US CT Rocky Hill
- Agent Steven C. Bauman; James E. Piotrowski
- Main IPC: C09J4/00
- IPC: C09J4/00
Abstract:
Solvent free, moisture curable reactive hot melt adhesives are prepared using an oxazolidine functional prepolymer and a polyfunctional isocyanate.
Public/Granted literature
- US20100152394A1 REACTIVE HOT MELT ADHESIVE Public/Granted day:2010-06-17
Information query
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