Invention Grant
- Patent Title: Conformal magnetron sputter deposition
- Patent Title (中): 保形磁控溅射沉积
-
Application No.: US11838399Application Date: 2007-08-14
-
Publication No.: US08277617B2Publication Date: 2012-10-02
- Inventor: Kuang-Tsan Kenneth Chiang , Ronghua Wei
- Applicant: Kuang-Tsan Kenneth Chiang , Ronghua Wei
- Applicant Address: US TX San Antonio
- Assignee: Southwest Research Institute
- Current Assignee: Southwest Research Institute
- Current Assignee Address: US TX San Antonio
- Agency: Grossman, Tucker et al
- Main IPC: C23C14/00
- IPC: C23C14/00 ; C23C14/32 ; C25B9/00 ; C25B11/00 ; C25B13/00

Abstract:
An apparatus and method for magnetron sputter coating of an interior surface of a hollow substrate defining at least one irregular contour. The apparatus may contain a vacuum chamber and a target containing one or more metals having an exterior surface defining at least one irregular contour. The exterior surface of the target may be configured to conform to at least a portion of an irregular contour of the interior surface of the hollow substrate to be coated. A magnet assembly may be supplied which may include a plurality of magnets where the magnets are positioned substantially within a metallic target alloy.
Public/Granted literature
- US20090045047A1 Conformal Magnetron Sputter Deposition Public/Granted day:2009-02-19
Information query
IPC分类: