Invention Grant
US08277723B2 High-purity hafnium, target and thin film comprising high-purity hafnium, and process for producing high-purity hafnium
有权
高纯度铪,包含高纯度铪的目标和薄膜,以及生产高纯度铪的方法
- Patent Title: High-purity hafnium, target and thin film comprising high-purity hafnium, and process for producing high-purity hafnium
- Patent Title (中): 高纯度铪,包含高纯度铪的目标和薄膜,以及生产高纯度铪的方法
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Application No.: US11994167Application Date: 2006-06-12
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Publication No.: US08277723B2Publication Date: 2012-10-02
- Inventor: Yuichiro Shindo
- Applicant: Yuichiro Shindo
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Howson & Howson LLP
- Priority: JP2005-198901 20050707
- International Application: PCT/JP2006/311722 WO 20060612
- International Announcement: WO2007/007498 WO 20070118
- Main IPC: C22C27/00
- IPC: C22C27/00 ; C23C14/34 ; C25C5/00

Abstract:
Provided is a method of manufacturing high-purity hafnium by using a hafnium sponge with reduced zirconium as the raw material in which the impurity content of Fe, Cr, and Ni, the impurity content of Ca, Na, and K, the impurity content of Al, Co, Cu, Ti, W, and Zn, the alpha dose, the impurity content of U and Th, the impurity content of Pb and Bi, and the content of C as a gas component contained in the hafnium are reduced. Based on this efficient and stable manufacturing technology, additionally provided are a high-purity hafnium material obtained from the foregoing high-purity hafnium, as well as a sputtering target, a gate insulation film and a metal gate thin film, which are formed from this material. This high-purity hafnium has a purity 6N or higher except Zr and gas components, wherein Fe, Cr and Ni are respectively 0.2 ppm or less, Ca, Na and K are respectively 0.1 ppm or less, and Al, Co, Cu, Ti, W and Zn are respectively 0.1 ppm or less.
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