Invention Grant
- Patent Title: Device housing
- Patent Title (中): 设备外壳
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Application No.: US13150362Application Date: 2011-06-01
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Publication No.: US08277951B2Publication Date: 2012-10-02
- Inventor: Hsin-Pei Chang , Wen-Rong Chen , Huann-Wu Chiang , Cheng-Shi Chen , Cong Li
- Applicant: Hsin-Pei Chang , Wen-Rong Chen , Huann-Wu Chiang , Cheng-Shi Chen , Cong Li
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010273222 20100906
- Main IPC: B32B15/04
- IPC: B32B15/04 ; B32B15/20 ; B32B18/00
Abstract:
A device housing is provided. The device housing includes a substrate, a barrier layer formed on the substrate, an illuminating layer formed on the barrier layer, and a protective layer formed on the illuminating layer. The barrier layer is made of titanium. The illuminating layer is made of rare-earth aluminates. The protective layer is made of silica dioxide. A method for making the device housing is also described there.
Public/Granted literature
- US20120058361A1 DEVICE HOUSING AND METHOD FOR MAKING THE SAME Public/Granted day:2012-03-08
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