Invention Grant
US08278028B2 Material pattern, and mold, metal thin-film pattern, metal pattern using thereof, and methods of forming the same
有权
材料图案和模具,金属薄膜图案,使用其的金属图案及其形成方法
- Patent Title: Material pattern, and mold, metal thin-film pattern, metal pattern using thereof, and methods of forming the same
- Patent Title (中): 材料图案和模具,金属薄膜图案,使用其的金属图案及其形成方法
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Application No.: US12098180Application Date: 2008-04-04
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Publication No.: US08278028B2Publication Date: 2012-10-02
- Inventor: Jin-Wan Jeon , Jun-Bo Yoon , Koeng Su Lim
- Applicant: Jin-Wan Jeon , Jun-Bo Yoon , Koeng Su Lim
- Applicant Address: KR
- Assignee: Korea Advanced Institute of Science and Technology
- Current Assignee: Korea Advanced Institute of Science and Technology
- Current Assignee Address: KR
- Agency: The Belles Group, P.C.
- Priority: KR10-2007-0033378 20070404
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
The present invention relates to a material pattern, and mold using thereof, metal thin-film pattern, metal pattern, and method of forming the sames. A method of forming the material pattern according to the present invention comprises the steps of; (a) forming a photo-sensitive material film by coating a photo-sensitive material on a substrate; (b) deciding an exposure section on the photo-sensitive material film; (c) disposing a light refraction film and a light diffusion film at a route of light exposed on the photo-sensitive material film; and (d) forming a pattern on the photo-sensitive material film, by projecting a light on the exposure section of the photo-sensitive material film, wherein the light transmits the light refraction film and the light diffusion film.A method of forming the material pattern according to the present invention can form the material pattern of three-dimensional asymmetric structure having various inclinations and shapes and can form simply mold, metal thin-film and metal pattern using thereof.
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