Flip chip interconnect solder mask

Invention Grant

US08278144B2 Flip chip interconnect solder mask 有权

Title translation: 倒装芯片互连焊盘

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Patent Title: Flip chip interconnect solder mask
Patent Title (中): 倒装芯片互连焊盘
Application No.: US12362627

Application Date: 2009-01-30
Publication No.: US08278144B2

Publication Date: 2012-10-02
Inventor: Rajendra D. Pendse
Applicant: Rajendra D. Pendse
Applicant Address: SG Singapore
Assignee: STATS ChipPAC, Ltd.
Current Assignee: STATS ChipPAC, Ltd.
Current Assignee Address: SG Singapore
Agency: Patent Law Group: Atkins & Associates, P.C.
Agent Robert D. Atkins
Main IPC: H01L21/50
IPC: H01L21/50

Abstract:

A solder mask for flip chip interconnection has a common opening that spans a plurality of circuit elements. The solder mask allows confinement of the solder during the remelt stage of interconnection, yet it is within common design rules for solder mask patterning. Also, a substrate for flip chip interconnection includes a substrate having the common opening that spans a plurality of circuit elements. Also, a flip chip package includes a substrate having a common opening that spans a plurality of circuit elements.

Abstract(Chinese):

用于倒装芯片互连的焊接掩模具有跨越多个电路元件的公共开口。焊接掩模允许在互连的重熔阶段期间焊料的限制，但是在焊接掩模图案化的通用设计规则中。此外，用于倒装芯片布线的基板包括具有跨越多个电路元件的公共开口的基板。此外，倒装芯片封装包括具有跨越多个电路元件的公共开口的基板。

Public/Granted literature

US20090184419A1 Flip Chip Interconnect Solder Mask Public/Granted day:2009-07-23

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/50	...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的