Method and structure for integrating capacitor-less memory cell with logic

Invention Grant

US08278167B2 Method and structure for integrating capacitor-less memory cell with logic 有权

Title translation: 将无电容器存储单元与逻辑集成的方法和结构

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Patent Title: Method and structure for integrating capacitor-less memory cell with logic
Patent Title (中): 将无电容器存储单元与逻辑集成的方法和结构
Application No.: US12338404

Application Date: 2008-12-18
Publication No.: US08278167B2

Publication Date: 2012-10-02
Inventor: Gurtej S. Sandhu
Applicant: Gurtej S. Sandhu
Applicant Address: US ID Boise
Assignee: Micron Technology, Inc.
Current Assignee: Micron Technology, Inc.
Current Assignee Address: US ID Boise
Agency: Wells St. John, P.S.
Main IPC: H01L21/8238
IPC: H01L21/8238

Method and structure for integrating capacitor-less memory cell with logic

Abstract:

Methods for fabricating integrated circuits include fabricating a logic device on a substrate, forming an intermediate semiconductor substrate on a surface of the logic device, and fabricating a capacitor-less memory cell on the intermediate semiconductor substrate. Integrated circuits with capacitor-less memory cells formed on a surface of a logic device are also disclosed, as are multi-core microprocessors including such integrated circuits.

Abstract(Chinese):

制造集成电路的方法包括在衬底上制造逻辑器件，在逻辑器件的表面上形成中间半导体衬底，以及在中间半导体衬底上制造无电容器的存储单元。还公开了在逻辑器件的表面上形成有无电容器的存储器单元的集成电路，以及包括这种集成电路的多核微处理器。

Public/Granted literature

US20100155803A1 METHOD AND STRUCTURE FOR INTEGRATING CAPACITOR-LESS MEMORY CELL WITH LOGIC Public/Granted day:2010-06-24

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS